东威科技 (688700)
Kunshan Dongwei Technology Co., Ltd.
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Company NameKunshan Dongwei Technology Co., Ltd.
Listing Date2021-06-15
Issue Price9.41RMB
Registered Capital29840.13610k RMB
Legal RepresentativeLiu Jianbo
Registered AddressNo. 505 Dongding Road, Bacheng Town, Kunshan City, Jiangsu Province
IndustrySpecial Purpose Equipment
Main BusinessR&D, design, production, and sales of high-end precision electroplating equipment and supporting equipment
Company ProfileKunshan Dongwei Technology Co., Ltd. is an equipment manufacturing enterprise integrating R&D, production, and sales. The company is dedicated to in-depth R&D of PCB (Printed Circuit Board) electroplating equipment, focusing on professionalism and specialization. It takes pursuing the best productivity in the PCB industry as its mission, continuously improving PCB electroplating technology and providing the most advanced PCB electroplating equipment. Based on producing traditional PCB equipment such as primary copper, secondary copper, nickel-gold plating, PTH, and black oxide, the company vigorously promotes its new patented product—PCB Vertical Continuous Plating (VCP)—and has gradually launched a series of related vertical continuous plating equipment. It is the first in the industry to achieve standardization in VCP equipment design, streamlined production processes, and industrial-scale manufacturing. The company strives to provide PCB manufacturers with electroplating equipment that offers more stable performance, more advanced technology, simpler operation, and more economical costs through innovative design approaches. Business Philosophy: Create customer demand.
Stock Details
1. Key Indicators
- Total Shares(W): 29840.14
- Circulating A-Shares(W): 29840.14
- Earnings Per Share(RMB): 0.2900
- Net Assets Per Share(RMB): 6.0176
- Operating Revenue(W RMB): 75694.29
- Total Profit(W RMB): 9679.79
- **Net Profit Attributable to Parent(W RMB) **: 8536.73
- Net Profit Growth Rate(%): 24.80
- Weighted Return on Equity(%): 4.8400
- Operating Cash Flow Per Share(RMB): 0.2630
- Undistributed Profit Per Share(RMB): 1.7623
- Capital Reserve Per Share(RMB): 3.0718
2. Main Business
The main business covers:
- R&D, design, production and sales of high-end precision electroplating equipment and supporting equipment
3. Company Basic Information
- Company Name: Kunshan Dongwei Technology Co., Ltd.
- Listing Date: 2021-06-15
- Industry: Special Purpose Equipment Manufacturing
- Address: No. 505 Dongding Road, Bacheng Town, Kunshan City, Jiangsu Province
- Website: https://www.ksdwgroup.com/
- Company Profile: Kunshan Dongwei Technology Co., Ltd. was established through the overall change of Kunshan Dongwei Electroplating Equipment Technology Co., Ltd.
4. Top 10 Circulating Shareholders
| Rank | Institution Name | Institution Type | Shares Held (W) | Percentage Held (%) |
|---|---|---|---|---|
| 1 | Kunshan Fangfang Yuanyuan Enterprise Management Center (Limited Partnership) | Corporate Entity | 869.81 | 2.91 |
| 2 | Hong Kong Securities Clearing Company Ltd. | Northbound Capital | 856.51 | 2.87 |
| 3 | China Universal Asset Management - Social Security Fund 17022 Portfolio | Social Security Fund | 388.65 | 1.30 |
| 4 | Dacheng Technology Consumption Stock Fund Class A | Public Fund | 150.22 | 0.50 |
| 5 | Dacheng Growth Aggressive Mixed Fund Class A | Public Fund | 145.66 | 0.49 |
| 6 | CCB Innovation Driven Mixed Fund | Public Fund | 144.20 | 0.48 |
| 7 | CCB Potential New Blue-chip Stock Fund Class A | Public Fund | 85.81 | 0.29 |
| 8 | CCB Advantage Power Mixed Fund (LOF) | Public Fund | 76.71 | 0.26 |
| 9 | CCB Information Industry Stock Fund Class A | Public Fund | 70.36 | 0.24 |
| 10 | CCB Innovation China Mixed Fund | Public Fund | 40.99 | 0.14 |
5. Concept Sectors
- Photovoltaic
- High-end Equipment
- Chips
- GDR Included
- Solid-state Batteries
- Composite Copper Foil
- PCB Concept
- Margin Trading
- New Social Security Holdings
- Specialized, Refined, Unique, and New Enterprises
- SSE 380
- Sci-Tech Innovation High-end Equipment
- Sci-Tech Innovation 200
Remarks
- Data update date: 2025-09-30
- Data source: Public Market Information