华海诚科 (688535)
Jiangsu HHCK Advanced Materials Co., Ltd.
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Company NameJiangsu Huahai Chengke New Materials Co., Ltd.
Listing Date2023-04-04
Issue Price35RMB
Registered Capital9601.432310k RMB
Legal RepresentativeHan Jianglong
Registered AddressNo. 66 Dongfang Avenue, Economic and Technological Development Zone, Lianyungang City, Jiangsu Province
IndustrySemiconductor
Main BusinessR&D and industrialization of semiconductor packaging materials.
Company ProfileJiangsu Huahai Chengke New Materials Co., Ltd. is a national-level specialized, sophisticated, and innovative "Little Giant" enterprise focused on the R&D and industrialization of semiconductor packaging materials. Its main products are epoxy molding compounds and electronic adhesives. The company has grown into a large-scale epoxy molding compound manufacturer in China with a comprehensive product portfolio and continuous innovation capabilities. It has established a complete R&D and production system in the semiconductor packaging materials field and possesses fully independent intellectual property rights.
With breakthroughs in technological R&D, improvement of the product system, and expansion of market channels, the company's technical level, product quality, and brand have gained recognition from relevant regulatory authorities and well-known downstream customers. As the primary drafting unit, the company led the formulation of the national standard "Test Methods for Epoxy Molding Compounds for Electronic Packaging" (GB/T 40564-2021) and was recognized by the National Semiconductor Equipment and Materials Standardization Committee as the 2020 Outstanding Contributor to Standardization. Meanwhile, the company has established long-term and sound cooperative relationships with downstream renowned manufacturers such as JCET Group Co., Ltd. (600584.SH) and Tongfu Microelectronics Co., Ltd. (002156.SZ), and received the 2021 Best Partner Award from Customer B.
Stock Details
1. Key Indicators
- Total Shares(W): 8069.65
- Circulating A-Shares(W): 5245.55
- Earnings Per Share(RMB): 0.2500
- Net Assets Per Share(RMB): 12.7429
- Operating Revenue(W RMB): 27924.53
- Total Profit(W RMB): 2118.88
- **Net Profit Attributable to Parent(W RMB) **: 2005.04
- Net Profit Growth Rate(%): -42.58
- Weighted Return on Equity(%): 1.9200
- Operating Cash Flow Per Share(RMB): -0.0200
- Undistributed Profit Per Share(RMB): 1.7386
- Capital Reserve Per Share(RMB): 10.1707
2. Main Business
The main business covers:
- Production and sales of semiconductor packaging materials such as epoxy molding compounds and electronic adhesives
3. Company Basic Information
- Company Name: Jiangsu Huahai Chenke New Material Co., Ltd.
- Listing Date: 2023-04-04
- Industry: Electronics - Semiconductor
- Address: No. 66 Dongfang Avenue, Lianyungang Economic and Technological Development Zone, Jiangsu Province
- Website: https://www.hhck-em.com
- Company Profile: On September 30, 2015, Zhonghui Certified Public Accountants issued the "Audit Report of Jiangsu Huahai Chenke New Material Co., Ltd.", confirming that as of the audit base date July 31, 2015, the net assets of Huahai Chenke Limited were 46.0448 million yuan. On September 30, 2015, Tianyuan Asset Appraisal Co., Ltd. issued an appraisal report, confirming that as of the appraisal base date July 31, 2015, the assessed value of the net assets of Huahai Chenke Limited was 56.9156 million yuan. On September 30, 2015, the shareholders' meeting of Huahai Chenke Limited passed a resolution, agreeing to convert the audited net assets of Huahai Chenke Limited of 46.0448 million yuan as of July 31, 2015, into a total of 43 million shares at a conversion ratio of 1.0708:1, with the remaining portion included in the capital reserve. On October 14, 2015, Zhonghui Certified Public Accountants issued a capital verification report, verifying that as of October 14, 2015, the company had received the share capital of 43 million yuan converted from the net assets of Huahai Chenke Limited owned by all shareholders.
4. Top 10 Circulating Shareholders
| Rank | Institution Name | Institution Type | Shares Held (W) | Percentage Held (%) |
|---|---|---|---|---|
| 1 | Tianshui Huatian Technology Co., Ltd. | Corporate Legal Person | 325.76 | 6.21 |
| 2 | Shenzhen Hubble Technology Investment Partnership (Limited Partnership) | Corporate Legal Person | 121.04 | 2.31 |
| 3 | Harvest Competitiveness Preferred Hybrid Securities Investment Fund Class A | Fund | 81.40 | 1.55 |
| 4 | National Social Security Fund 602 Portfolio | Social Security Fund | 51.02 | 0.97 |
| 5 | Founder Fubon Technology Innovation Hybrid Securities Investment Fund Class A | Fund | 3.50 | 0.07 |
| 6 | Jinxin Minchang Flexible Allocation Hybrid Securities Investment Fund Class A | Fund | 2.93 | 0.06 |
| 7 | China AMC Dingpei Bond Securities Investment Fund Class A | Fund | 0.30 | 0.01 |
5. Concept Sectors
- Automotive Electronics
- Chip
- Advanced Packaging
- Memory Chip
- Margin Trading & Securities Lending
- Share Buyback Plan
- Private Placement Shares
- High Beta
- High-Priced Stock (Over 100 RMB)
- Recently Weak Performance
- Restructuring Stock
- Proposed Reduction
- High Margin Financing
- New Social Security Fund Holdings
- Specialized, Refined, Special and New Enterprises
- Below Private Placement Price
- Special Loans
- Sci-Tech Innovation Board Materials
- Sci-Tech Innovation 200 Index
- SSE 580 Index
Remarks
- Data update date: 2025-11-10
- Data source: Public Market Information